Integrated testing and handling mechanism

ABSTRACT

An integrated testing and handler mechanism includes an input/output module including: an input section, an output section, a turret that includes a plurality of pickup heads, and a shuttle configured to move the carrier from the component loading location to a test module transfer location; and a test module including: a test head comprising an array of a plurality of test sockets, a plunger configured to plunge the components held by the carrier into the test sockets when the carrier is located on the plunger, and a rotary table that includes a plurality of grippers that rotate around the rotary table, the rotary table being configured to (i) transfer a carrier between the test module transfer location and an input/output module transfer location, (ii) rotate the carrier between the input/output module transfer location and a plunger transfer location, and (iii) transfer the carrier between the plunger transfer location and plunger.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application claims the benefit of U.S. Provisional PatentApplication No. 61/902,575, filed Nov. 11, 2013, which is hereinincorporated by reference in its entirety.

FIELD OF THE INVENTION

The present disclosure relates to an integrated testing and handlermechanism, and more particularly to an integrated testing and handlingmechanism allowing for parallel testing of multiple components.

BACKGROUND OF THE INVENTION

This section is intended to provide a background or context to theinvention that is recited in the claims. The description herein mayinclude concepts that could be pursued, but are not necessarily onesthat have been previously conceived or pursued. Therefore, unlessotherwise indicated herein, what is described in this section is notprior art to the description and claims in this application and is notadmitted to be prior art by inclusion in this section.

Handler apparatuses are used to transport electronic components anddevices, such as integrated circuit (TC) devices. Such apparatuses arecommonly used to transport such components to and from a testingapparatus that assesses a component's performance. In this regard, ahandler is used to insert the component into a test socket of a testingapparatus, such as an electrical tester. Such electrical testers areoften used to determine various performance-related characteristics.

Many currently available test techniques perform testing before thewafers on which the devices are arranged have been diced and sorted.However, dicing and sorting can affect reliability, and also performingtesting after such processes is costly and takes additional time. As diethickness decreases, the risk for damage caused by dicing and handlingincreases. Thus, it would be advantageous to provide an improved testingand handler mechanism allowing for parallel testing in order to lowercost, improve reliability, and potentially avoid the need for humanintervention in transporting components from a test station to a finalpackaging station.

SUMMARY OF THE INVENTION

According to one embodiment, an integrated testing and handler mechanismcomprises a test module including: a plurality of carriers, each of thecarriers being configured to hold a plurality of components, a contactorarray comprising an array of a plurality of test sockets, and a plungerconfigured to plunge the components held by the carrier into the testsockets when the carrier is located on the plunger; and an input/outputmodule including: an input section, an output section, an input shuttleassembly, an output shuttle assembly, a turret configured to: (i) movecomponents to be tested from the input section to the input shuttleassembly, and (ii) move tested components from the output shuttleassembly to the output section, a first pick-and-place device configuredto move a row of components to be tested from the input shuttle assemblyto at least one of the carriers, and a second pick-and place deviceconfigured to move a row of tested components from at least one of thecarriers to the output shuttle assembly.

In one aspect, the first shuttle is an alternating dual shuttlecomprising two independently driven shuttles each configured to hold arow of the components to be tested.

In one aspect, the integrated testing and handler mechanism furthercomprises a vision alignment system.

In one aspect, the integrated testing and handler mechanism furthercomprises a controller configured to control movement of the plunger,wherein the plunger is configured to move in an x-direction, ay-direction, and a θ-direction to align the carrier located on theplunger relative to the contactor array.

In one aspect, the vision alignment system further comprises at leastone camera that measures a position of at least one fiducial marking ona carrier and at least one fiducial marking on the socket arrangement.

In one aspect, output shuttle assembly is a curved air track.

In one aspect, the curved air track is configured such that testedcomponents can be blown back into the turret.

In one aspect, the output shuttle assembly is an alternating dualshuttle assembly.

In one aspect, wherein the input/output module is configured such thatthe input shuttle assembly is loaded while the output shuttle assemblyis unloaded.

In one aspect, at least one of the carriers is a single device carrierthat clamps the components therein so as to maintain positions of thecomponents.

In one aspect, the integrated testing and handler mechanism furthercomprises a gripping mechanism that urges the at least one carrier ontothe plunger.

In one aspect, the input section comprises a wafer table, and the outputsection comprises a tray.

In one aspect, the test module further comprises amicro-electrical-mechanical (“MEMS”) stimulus module.

In one aspect, the integrated testing and handler mechanism furthercomprises an active thermal control system configured to heat thecomponents while the components are on the plunger

In one aspect, the integrated testing and handler mechanism furthercomprises a conductive soaking module comprising a plate configured toheat or cool components located on a carrier when the carrier is in theconductive soaking module.

In another embodiment, an integrated testing and handler mechanismcomprises a test module including: a contactor array comprising an arrayof a plurality of test sockets, a shuttle assembly comprising at leasttwo shuttles, and a rotatable plunger comprising a plurality of sides,each side including a plurality of plunger heads, the rotatable plungerbeing configured to (1) receive components in the plurality of plungerheads on one of the sides, (ii) rotate the components such that thecomponents face the contactor array, (iii) plunge the components intothe test sockets for testing, (iv) rotate the tested components suchthat the tested component face a shuttle of the shuttle assembly, and(v) deposit the tested components onto the shuttle; and an input/outputmodule including: an input section, an output section, a wafer table, afirst pick-and-place device configured to retrieve components to betested from the wafer table in a vertical direction, rotate theretrieved components, and plunge the retrieved components in ahorizontal direction into the plunger heads on one of the sides of therotatable plunger, a second pick-and-place device configured to movetested components from the shuttle of the shuttle assembly to the outputsection.

In one aspect, the integrated testing and handler mechanism furthercomprises an active thermal control system configured to heat thecomponents while the components are on the rotatable plunger.

In one aspect, the integrated testing and handler mechanism furthercomprises a visional alignment system that includes a camera thatmeasures positions of the components on the rotatable plunger.

In one aspect, the integrated testing and handler mechanism furthercomprises a controller configured to forward position informationderived from the camera to an individually actuatable alignment frame ofthe contactor array.

In one aspect, the integrated testing and handler mechanism furthercomprises a vision inspection system.

In another embodiment, an integrated testing and handler mechanismcomprises an input/output module including: an input section, an outputsection, a turret that includes a plurality of pickup heads, the pickupheads being configured to (i) move components from the input section toa carrier located in a component loading location, and (ii) movecomponents from the carrier located in the component loading location tothe output section, and a shuttle configured to move the carrier fromthe component loading location to a test module transfer location; and atest module including: a test head comprising an array of a plurality oftest sockets, a plunger configured to plunge the components held by thecarrier into the test sockets when the carrier is located on theplunger, and a rotary table that includes a plurality of grippers thatrotate around the rotary table, the rotary table being configured to (i)transfer a carrier between the test module transfer location and aninput/output module transfer location, (ii) rotate the carrier betweenthe input/output module transfer location and a plunger transferlocation, and (iii) transfer the carrier between the plunger transferlocation and the plunger.

In one aspect, the test module includes a test module vision alignmentsystem configured to align components on the carrier to the test socketsof the contactor array.

In one aspect, the integrated testing and handler mechanism furthercomprises a conductive soaking module comprising a plate configured toheat or cool components in the carrier when the carrier is lowered ontothe plate by the gripper.

In one aspect, the input/output module includes an input/output modulevision alignment system configured to align components on the carrier.

In one aspect, the input/output vision alignment system includes: afirst downward-looking camera configured to view a component to betransferred to the carrier, and a controller configured to determine atranslational and angular offset between (i) a contact pattern of thecomponent and (ii) a package outline of the component, based oninformation received from the first downward-looking camera.

In one aspect, the input/output vision alignment system furtherincludes: an upward-looking camera configured to view the pickup headwhile the pickup head holds a component, wherein the controller isconfigured to determine a translational and angular offset between (i)the package outline of the component and (ii) the pickup head, based oninformation received from the upward-looking camera.

In one aspect, the input/output vision alignment system furtherincludes: an alignment table configured to hold a component by vacuum,wherein the controller is configured to cause the alignment table tomove such that the component is aligned to the pickup head, based on thedetermined translational and angular offset between (i) the packageoutline of the component and (ii) the pickup head.

In one aspect, the input/output vision alignment system furtherincludes: a second downward-looking camera configured to view thecarrier, wherein the controller is configured to determine atranslational and angular offset between the carrier and the pickuphead.

In one aspect, the carrier includes a plurality of fiducials by whichthe controller is configured to determine the translational and angularoffset between the carrier and the pickup head.

In one aspect, the controller is configured to determine a thermalelongation of the carrier based on locations of the fiducials.

In one aspect, the controller is configured to control linear encodersof the shuttle to move the carrier such that the carrier is aligned tothe pickup head, based on the determined translational and angularoffset between the carrier and the pickup head.

In one aspect, the controller is configured to control linear encodersof the shuttle to move the carrier such that the carrier is aligned tothe pickup head, based on the determined translational and angularoffset between the carrier and the pickup head, and based on the thermalelongation of the carrier.

In one aspect, the carrier is a vacuum carrier.

In one aspect, the carrier is a kitless carrier.

In one aspect, the carrier comprises: a main body, a front vacuuminterface, and a bottom vacuum interface.

In one aspect, the carrier comprises: a main body including: a lowerbody portion, an upper body, a central vacuum supply chamber locatedbetween the lower body portion and the upper body portion, and acomponent placement layer disposed over the upper body portion, thecomponent placement layer having a planar upper surface on whichcomponents are place-able, wherein a plurality of vacuum cavities extendthrough the upper body portion from the central vacuum supply chamber tothe component placement layer; and at least one vacuum interface.

In one aspect, the component placement layer is made of a porousconductive material.

In one aspect, the component placement layer includes a plurality ofmicro-holes that extend through the component placement layer from eachvacuum supply cavity to an upper surface of the component placementlayer.

In one aspect, the integrated testing and handler mechanism isconfigured to maintain a vacuum supply to the carrier while the carrieris at the turret of the input/output module for component loading andunloading, during carrier transport on the shuttle, while the carrier istransferred between the shuttle and the rotary table, while the carrieris gripped by the gripper of the rotary table, while the carrier ismoved between the rotary table and the plunger, and while the carrier ison the plunger during testing.

In one aspect, the integrated testing and handler mechanism isconfigured to maintain a vacuum supply to the carrier by alternatelysupplying vacuum via the front vacuum interface and the bottom vacuuminterface.

In another embodiment, a carrier for carrying components comprises: amain body including: a lower body portion, an upper body, a centralvacuum supply chamber located between the lower body portion and theupper body portion, and a component placement layer disposed over theupper body portion, the component placement layer having a planar uppersurface on which components are placeable, wherein a plurality of vacuumcavities extend through the upper body portion from the central vacuumsupply chamber to the component placement layer; and at least one vacuuminterface.

In one aspect, the component placement layer is made of a porousconductive material.

In one aspect, the component placement layer includes a plurality ofmicro-holes that extend through the component placement layer from eachvacuum supply cavity to an upper surface of the component placementlayer.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the invention are described by referring to the attacheddrawings, in which:

FIG. 1 is a first functional diagram for an integrated testing andhandler mechanism;

FIG. 2 is a top view schematic diagram of an integrated testing andhandler mechanism in accordance with the functional diagram of FIG. 1,according to a first embodiment;

FIG. 3 is a top view schematic diagram of an integrated testing andhandler mechanism in accordance with the functional diagram of FIG. 1;according to a second embodiment;

FIG. 4 is a side view schematic diagram of the integrated testing andhandler mechanism of FIG. 3;

FIG. 5 is a second functional diagram of an integrated testing andhandler mechanism;

FIG. 6 is a perspective view of an integrated testing and handlermechanism in accordance with the functional diagram of FIG. 5, accordingto a third embodiment;

FIG. 7 is a top view schematic diagram of an integrated testing andhandler mechanism of FIG. 6;

FIG. 8 is a top view schematic diagram of an integrated testing andhandler mechanism in accordance with the functional diagram of FIG. 7,according to a fourth embodiment;

FIG. 9 is a perspective view of an integrated testing and handlermechanism in accordance with the functional diagram of FIG. 1, accordingto an alternative embodiment;

FIG. 10 is a flow diagram for a method of testing and handling accordingto an embodiment of the invention;

FIG. 11 is a perspective view of an integrated testing and handlermechanism according to a fourth embodiment;

FIG. 12 is a top view schematic diagram of an integrated testing andhandler mechanism according to a fourth embodiment;

FIG. 13 is another top view schematic diagram of an integrated testingand handler mechanism according to a fourth embodiment;

FIG. 14 is a perspective view of a carrier in accordance with anembodiment of the invention;

FIG. 15 is a perspective view of a portion of a carrier in accordancewith an embodiment of the invention;

FIG. 16 is a top view of a carrier in accordance with an embodiment ofthe invention;

FIG. 17 is a cross-sectional view of a carrier, taken along a portion ofthe line A-A in FIG. 16, in accordance with an embodiment of theinvention;

FIG. 18 is a cross-sectional view of a carrier, taken along a portion ofthe line A-A in FIG. 16, in accordance with another embodiment of theinvention;

FIG. 19 is a top view schematic diagram of an integrated testing andhandler mechanism, showing vacuum usage during material flow;

FIG. 20 is a top view schematic diagram of an integrated testing andhandler mechanism, demonstrating a first step of a vision alignmentprocess;

FIG. 21 is a top view schematic diagram of an integrated testing andhandler mechanism, demonstrating a second step of a vision alignmentprocess;

FIG. 22 is a top view schematic diagram of an integrated testing andhandler mechanism, demonstrating a third step of a vision alignmentprocess;

FIG. 23 is a top view schematic diagram of an integrated testing andhandler mechanism, demonstrating a fourth step of a vision alignmentprocess;

FIG. 24 is a top view schematic diagram of an integrated testing andhandler mechanism, demonstrating a fifth step of a vision alignmentprocess;

FIG. 25 is a side schematic diagram of pickup head and carrier,demonstrating the occurrence of “shingling”; and

FIG. 26 is a side schematic diagram of an integrated testing and handlermechanism, before docket (top) and after docking (bottom).

DETAILED DESCRIPTION

In the following description, for purposes of explanation and notlimitation, details and descriptions are set forth in order to provide athorough understanding of embodiments of the present invention. However,it will be apparent to those skilled in the art that the presentinvention may be practiced in other embodiments that depart from thesedetails and descriptions. For example, while the embodiments below aredescribed in reference to a mechanism used to handle and test electroniccomponents, the mechanism may be used in other applications.

First Functional Diagram

A first functional diagram for an integrated testing and handlermechanism is shown in FIG. 1. The first and second embodiments describedbelow are configured in accordance with the first functional diagram.

First Embodiment: Integrated Turret Loader/Unloader and X-Y-θ PlungerSystem

As shown in FIG. 2, an integrated testing and handier mechanism 100includes a test module 101 and an input/output module 102. Componentsare tested in the test module 101 components while other components arebeing handled by the input/output module 102. The test module 101 andinput/output module 102 are docked to one another in a horizontalmanner. Components suitable for handling by the input/output module 102and the test module 101 include ball grid arrays (“BGAs”), quad-flatno-leads (QFN) packages, silicon-on-insulator (“SO”) devices, andvarious dies, among others.

Test Module

The integrated testing and handler mechanism 100 includes a test module101. Referring to FIG. 2, the test module 101 includes a plurality ofcarriers 3. The carriers 3 can be boat carriers, in which components areplaced into cavities within the carrier, or a single-device carrier(“SDC”), in which components are places into cavities and then clampedinside the cavity using springs. By mechanically clamping components inthe cavity, SDC type carriers maintain the position of componentstherein despite severe mechanical shock or vibration. SDC type carriersare described, for example, in European Patent Application No. 13 154816, the contents of which are incorporated by reference in theirentirety. The carrier 3 is configured such that a pitch of the carriermatches a pitch of a plunger, which is described below. A single carrier3 holds, for example, between 8 and 128 components, or more than 128components.

The test module 101 includes a contactor area 9 at which components aretested. A contactor array (i.e., test head) having a plurality of testsockets is located in the contactor area 9. After the carrier is movedto the contactor area 9, a plunger moves the carrier upward so that thecomponents are inserted into the test sockets. The plunger and contactorarray are configured such that the simultaneous testing of allcomponents in the carrier may be performed, or testing of only a subsetof the components in the carrier may be performed. The plunger andcontactor array may be configured similarly to those in the SO3000test-in-strip handler, produced by Rasco GmbH.

The test module 101 includes a vision alignment system. The visionalignment system permits visual alignment of groups of components. Thearray of cavities in the carrier can be aligned in the x, y, and θdirections to the array of test sockets of the contactor array. Thevision alignment system includes cameras that measure positions offiducial markers located on the carrier and fiducial markers located onthe contactor array. Based on offsets of corresponding fiducial markers,a position controller for the plunger is configured to move the plungersuch that the components in the carrier are aligned to the contactorarray.

The test module 101 further includes a conductive soaking module locatedin a conductive soaking area 10. The soaking module is configured tobring components to required test temperatures (for example,temperatures between −60° C. and 160° C.). For cold soaking, the soakingarea may be held in a dry atmosphere (e.g., gaseous nitrogen or dry airwith a dew point below −70° C.) to prevent condensation of water on thecomponents or carriers.

The soaking module is an SDC/boat based soaking module, or a“soak-on-plunger” module. In an SDC/boat based soaking module, a carrierholding untested components is brought to a test temperature by movingthe carrier over a hot or cold plate in the conductive soaking area. Theplunger and the contact sockets are also kept at test temperature. In asoak-on-plunger module, which is typically used for small components (3mm×3 mm), components are moved directly onto a plunger without beingsoaked on the hot or cold plate, and the plunger itself brings thecomponents to test temperature.

Input/Output Module

The integrated testing and handler mechanism 100 includes aninput/output module 102.

The input/output module 2 of the mechanism transports untestedcomponents from an input device located in an input section 5 tocarriers 3 of the test module 101, and transports tested components fromthe carriers 3 to an output device located in an output section 6. Theinput device is a tube type device, a bowl type device, or a detapingdevice for tape and reel packages. The output device is a tube typedevice (holding one bin), a bulk type device (holding, for example,eight bins), or a tape and reel device (holding one bin).

The input/output module 102 is turret based. For example, theinput/output module 102 may be configured similarly to the NY20 turrethandler, or the NX32 turret handler, available from Cohn, Inc. Theinput/output module 102 preferably has a throughput of at least 25,000components per hour.

Referring again to FIG. 2, the integrated testing and handler mechanism100 includes pick-and-place devices 4 a, 4 b for moving components to betested to and from the carriers. A first pick-and-place device 4 a is amultiple pick-and-place device configured to pick up a row of components(or other subset of components) from an input shuttle apparatus 8 andmove the row to a carrier 3. A second pick-and-place device 4 b is amultiple pick-and-place device configured to pick up at least one row oftested components (or other subset of tested components) from a carrier3 and more the row to an output shuttle apparatus 7.

The input shuttle apparatus 8 is an alternating dual shuttle apparatus,which includes two independently driven shuttles, each of the twoindependently driven shuttles being configured to hold one rowcomponents to be moved to the carrier. While one shuttle of the inputshuttle apparatus 8 is loaded by the turret cavity-by-cavity, the othershuttle of the input shuttle apparatus 8 is unloaded in a single step bythe pick-and-place device 4 a. The input shuttle apparatus 8 may allowfor pitch adaption.

The output shuttle 7 is a curved air track or an alternating dualshuttle with track rotation. If the output shuttle 7 is configured as analternating dual shuttle, each shuttle is configured to a rotate arounda vertical axis so as to adapt to different component orientations atthe loading and unloading positions.

Operation of the Integrated Turret L/U and X-Y-θ Plunger System

The integrated testing and handler mechanism 100 of the first embodimentoperates as follows. Components to be tested are loaded from the inputsection 5 of the turret into the input shuttle apparatus 8. The multiplepick-and-place device 4 a transfers one complete row of components intoan empty carrier 3. While moving through the conductive soaking area 10,both components and the carrier are brought up to the test temperature.A gripper mechanism or other similar transportation unit (not shown)moves the carrier 3 onto the plunger. The carrier 3 containing thecomponents is moved up by the plunger to a contact a contactor arrayincluding a plurality of test sockets to thereby establish an electricalcontact between the components and the test sockets. After electricaltesting has been performed, the plunger retrieves the carrier 3 from thesocket arrangement, and the carrier 3 is unloaded from the plunger by agripper mechanism or a similar transportation unit (not shown). The boatis unloaded by the multiple pick-and-place device 4 b, which transfersone complete row of components into the output shuttle apparatus 7. Inthe output shuttle apparatus 7, air blows the components back to theturret, which moves tested components to the output section 6.

Second Embodiment: Alternative Integrated Turret L/U and X-Y-θ PlungerSystem

As shown in FIG. 3, an integrated testing and handler mechanism 200according to a second embodiment includes a test module 201 and aninput/output module 202.

The second embodiment is similar in its principles to the firstembodiment. The integrated testing and handler mechanism 200 differsfrom the integrated testing and handler mechanism 100 as describedbelow.

In the second embodiment, the input device may be a film frame device,in which case the input section includes a wafer table configured tohandle small devices on a film frame. The input device may alternativelybe a tray type device, a tube type device, a bowl type device, or adetaping device. The output device may be a tray type device, a tubetype device (holding one bin), a bulk type device (holding, for example,eight bins), or a tape and reel device (holding one bin).

Turning to FIG. 4, the integrated testing and handier mechanism 200includes a test head or Micro-Electrical-Mechanical System (“MEMS”)stimulus 14 provided with the test module 201. The MEMS stimulus can bea MEMS testing device as described in U.S. Pat. No. 8,336,670, thecontents of which are incorporated by reference in their entirety. Thetest head or MEMS stimulus 14 is configured to be disposed above a lowerportion of the input/output module 202. The test head or MEMS stimulus14 is configured to permit overhead docking.

The MEMS stimulus device 14 includes a socket configured to receive thecarrier 3.

The MEMS stimulus device 14 is a pressure-based MEMS stimulus device, anacoustic MEMS stimulus device, a humidity MEMS stimulus device, aninertial MEMS stimulus device, or a magnetic MEMS stimulus device. Thepressure-based MEMS stimulus device, acoustic MEMS stimulus device, andhumidity MEMS stimulus device may be configured such that the carrier 3is plunged onto an open pressure chamber, where the carrier 3 acts as asealing cover. The inertial MEMS stimulus device is configured such thatthe carrier 3 is plunged onto a mechanism which can be moved and rotatedin three axes (x, y, and z). The magnetic MEMS stimulus is configuredsuch that the carrier 3 is plunged onto a unit which includes anelectric coil that stimulates a magnetic field in three axes (x, y, andz).

Second Functional Diagram

A second functional diagram for an integrated testing and handlermechanism is shown in FIG. 5. The third embodiment described below isconfigured in accordance with the second functional diagram.

Third Embodiment: Small Part Pick and Place System

Referring to FIG. 6, an integrated testing and handler mechanism 300includes a test module 301 and an input/output module 302. Componentsare tested in the test module 301 components while other components arebeing handled by the input/output module 302. The test module 301 andinput/output module 302 are docked to one another in a horizontalmanner.

The integrated testing and handler mechanism 300 includes a computer 40.The computer 40 is further configured to communicate with and controlthe test module 301 and the input/output module 302, and to analyze datatherefrom. The computer is configured to monitor and assess theperformance of the test module 301 and the input/output module 302.

Test Module

The integrated testing and handler mechanism 100 includes a test module301.

The test module 301 of the integrated testing and handler mechanism 300includes a rotary plunger 29 with Active Thermal Control (“ATC”) such asthat described in U.S. Pat. No. 7,355,428, issued on Apr. 8, 2008, whichis hereby incorporated by reference in its entirety. The rotary plungeris configured to permit individual alignment of components. The rotaryplunger 29 is provided with a plurality of conductive chucks 25configures to hold components.

The rotary plunger 29 allows four steps to be done simultaneously. Onegroup of components is loaded only a first side of the rotary plunger29. Simultaneously, another group of components, located on a secondside of the rotary plunger 29, are temperature soaked and visioninspected. Simultaneously, another group of components, located on athird side of the rotary plunger 29, are aligned and tested.Simultaneously, another group of components are unloaded from a fourthside of the rotary plunger 29 to an output shuttle 32. Each side of therotary plunger may hold, for example, 16 components.

The integrated testing and handler mechanism 300 includes a visioninspection system 22 (e.g., 5S inspection).

The integrated testing and handler mechanism 300 is configured to permitvisual alignment of components. Each component is picked individually byone head of the rotary plunger 29. After a 90° or 180° rotation, acamera measures a relative position of a component on the head of therotary plunger 29. A controller is configured to forward positioninformation derived from the measurement to an individually actuatedalignment frame of a contactor array. After another 90° rotation, thehead of the rotary plunger 29 plunges the component into a contactorsocket. While the plunger head is moving into the socket, itsimultaneously travels through the pre-adjusted alignment frame, thuscorrecting the positioning of the plunger head in x, y, and θdirections.

The test module 301 includes an alternating dual shuttle assembly 31.The alternating dual shuttle assembly includes two shuttles 32. Whiletested components are loaded one a first shuttle 32 from the rotaryplunger, tested components from the second shuttle 32 are unloaded fromthe second shuttle 32 to a tape of the tape-and-reel.

Input/Output Module

The integrated testing and handler mechanism 300 includes aninput/output module 302.

The input/output module includes an input section including an inputcassette 5, and an output cassette 6. The input/output module includesan output section including a tape and reel output 26. Components areloaded into the input cassette 5 on film frames, and moved to a wafertable 30. Empty film frames are removed from the output cassette 6.Tested components are removed from the output reel 20 of a tape and reeloutput 26. Other input and output devices may be used, such as tubes,trays, or bulk devices.

The input/output module 302 includes a multi-function pick-and-placedevice 44. The multi-function pick-and-place device 44 sequentiallypicks up components from the wafer table 30, rotates the group ofcomponents by 90°, and moves the group of components to the rotaryplunger 29. The multi-function pick-and-place device 44 is alsoconfigured to adjust its pitch (i.e., distance between components), tomatch the pitch of the rotary plunger. The multi-function pick-and-placedevice 44 is configured to plunge up to four devices (or other multiplesof two) simultaneously on the rotary plunger 29.

The integrated testing and handler mechanism 300 also includes a singleor dual pick-and-place device 27, which moves tested components from ashuttle 32 of the alternating dual shuttle assembly 31 to a tape of thetape and reel output 26.

The integrated testing and handier mechanism 300 further includes areject container 21 configured to collect rejected components.

Operation of the Small Part Pick and Place System

The integrated testing and handler mechanism 300 of the third embodimentoperates as follows. Components to be tested are loaded into the inputcassette 5 of the input/output section 302 on film frames. Thecomponents are moved to the wafer table 30. The components are picked upfrom the wafer table 30 by the multi-function pick-and-place device 44.The multi-function pick-and-place devices rotates the components by 90°,adjusts the distance between components to match the pitch of the rotaryplunger 29, and plunges the components in a horizontal direction intothe conductive chucks 25 of the rotary plunger 29. While the componentsare on the rotary plunger, the active thermal control system heats thecomponents via the conductive chucks 25. The rotary plunger 29 rotatesthe components by 90° (such that the components are facing upward), anda camera measures relative positions the component on the heads of therotary plunger 29. A controller forwards position information derivedfrom the measurement to an individually actuated alignment frame of acontactor array. After another 90° rotation, the heads of the rotaryplunger 29 plunges the components into contactor sockets. While theplunger heads are moving into the contactor sockets, they travel throughthe pre-adjusted alignment frame, thus correcting the positioning of theplunger head in x, y, and 0 directions. After testing is complete, therotary plunger rotates another 90° (such that the components are facingdownward), and the rotary plunger 29 transfers the tested componentsinto a shuttle 32 of the alternating dual shuttle 31. The single or dualpick-and-place device 27 transfers the tested components onto a tape ofthe tape-and-reel output 26. Vision inspection is performed by thecamera 27. Rejected components are removed from the tape. The remainderof the components are wound onto the reel 20 of the tape-and-reel output26.

Variations on the First and Third Embodiments

In a variation of the third embodiment, the multi-function pick-andplace device of the third embodiment is replaced with a second single ordual pick and place device 33, which moves components from the wafertable 30 to a carrier 3. This alternative embodiment is shown in FIG. 8.Instead of the multi-function pick-and-place device moving partsdirectly from the wafer table 30 to the rotary plunger 29, the rotaryplunger 29 picks up parts from the carrier 3.

In a variation of the first embodiment, an integrated testing andhandler mechanism 400 includes an input/output module and a test moduleboth integrated with a turret 415. As shown in FIG. 9, the input/outputmodule includes an input pick-and-place device with pitch-on-the-flycapability. The input/output module includes a wafer stage 417configured to move in an x-direction, a y-direction, and a θ-direction.

The pick-and-place device 416 is a multiple pick-and-place device withpickup heads arranged around a horizontal axis at a 180° pitch. One sidecan load components from the wafer ring, where the other side cansimultaneously load components onto the test head 418. The multipleheads can also perform pitch adaption. Components are pickedsequentially from the wafer ring, but placed in one move (e.g., by row)onto the test head. The test heads can move in radial direction to allowthe loading of multiple rows, and in z-direction to perform the plunginginto the contactor array 420.

Station 419 is for vision aligning the components. Station 419 includestwo sub-stations that move in a tangential direction under the test head418. First the x-location, y-location, and θ-direction of all componentsare measured by one or more upward-looking cameras. After themeasurement, the camera is moved aside and a plurality of individualalignment frames are moved under the components. The components areplunged through the alignment frames and thereby aligned according tothe offsets measured by the upward-looking camera.

After the alignment, the components are moved by the test head to thecontactor station and plunged into the contactor array 420. Station 419and 420 may be combined into one station.

Station 421 is for vision inspection (e.g. 5S inspection) and tape andreel 423 unload. The test head unloads components by rows into an unloadshuttle, which is located below the test head and can move in a radialdirection. The components are inspected row-by-row by multiple cameras422 and then placed by a fast single pick-and-place device 424 into thetape and reel. The pick-and-place device can move in a radial directionand a tangential direction. Components that fail testing are put intoreject containers. The shuttle may be a single or an alternating dualshuttle.

Integrated Testing and Handling Methods

FIG. 10 shows a method for performing testing and handling with anintegrated testing and handling mechanism. The method includes moving atleast one component from a wafer to a turret (step 201) and moving theat least one component into a shuttle (step 202). The method furtherincludes taking the at least one component out of the shuttle (step203), placing the at least one component into a carrier (step 204),taking the at least one component out of the carrier (step 205), andplacing the at least one component into the shuttle (step 206). Themethod additionally includes taking the at least one component from theshuttle and placing it in the turret (step 207) before placing the atleast one component onto a tape of a tape-and-reel system (step 208).

Fourth Embodiment: Carrier Transfer Type Pick and Place System

Referring to FIG. 11, an integrated testing and handler mechanism 500includes a test module 501 and an input/output module 502. Componentsare tested in the test module 501 while other components are beinghandled by the input/output module 502. The test module 501 and theinput/output module 502 are docked to one another in a horizontalmanner. Components suitable for handling by the input/output module 502and the test module 501 include bumped die (WLP) type devices, bare dietype devices, and Flat No-Leads Packages (such as quad-flat no-leads(QFN) packages and dual-flat no-leads (DFN) packages).

Test Module

The integrated testing and handler mechanism 500 includes a test module501.

Referring to FIGS. 12 and 13, the test module 501 includes a contactorarea 508 at which components are tested. A test head having a pluralityof test sockets is located above the contactor area 508. After a carrier600 is moved to the contactor area 508, a plunger moves the carrier 600upward so that the components are inserted into the test sockets. Theplunger and test head are configured such that the simultaneous testingof all components in the carrier 600 may be performed, or testing ofonly a subset of the components in the carrier 600 may be performed. Theplunger and test head may be configured similarly to those in the Jaguarstrip handler, produced by Rasco GmbH.

The test module 501 includes a plurality of carrier stations 504. In theembodiment shown in FIG. 12, the rotary table 503 includes eight carrierstations 504. In the embodiment shown in FIG. 13, the rotary table 503includes twelve carrier stations 504. The number of carrier stations 504may range from one to twelve or greater, preferably between two andtwelve, and more preferably between eight and twelve.

The test module 501 includes a rotary table 503. The rotary table 503includes a plurality of grippers. In this embodiment, the rotary table503 includes one gripper per carrier station 504. The grippers rotate ina circle from an input/output module transfer location 505 to a plungertransfer location 506 and then back to the input/output module transferlocation 505. The grippers are configured to retrieve a carrier 600 froma shuttle 507 of the input/output module 502, hold the carrier 600 whilethe rotary table rotates the grippers around the rotary table by anindex angle (for example, 30° where there are twelve carrier stations)to the carrier stations 504, transfer the carrier 600 to the contactorarea 508, and return the carrier 600 to the shuttle 507.

The test module 501 further includes a conductive soaking module locatedin a conductive soaking area 509. The soaking module is configured tobring components to required test temperatures (for example,temperatures between −60° C. and 160° C.). For cold soaking, the soakingarea may be held in a dry atmosphere (e.g., gaseous nitrogen or dry airwith a dew point below −70° C.) to prevent condensation of water on thecomponents or carriers 600. The soaking module is a boat based soakingmodule in which a carrier 600 holding untested components is brought toa test temperature by moving the carrier 600 over a hot or cold plate inthe conductive soaking area 509. The test module 501 also includes ade-soaking area 510 in which the components are returned (or at leastpartly returned) to room temperature. The hot or cold plates are locatedin the carrier stations 504 so that, when the gripper moves the carrier600 into a carrier station 504 in the conductive soaking area or thede-soaking area, the gripper lowers the carrier onto a hot or cold platein the carrier station 504. To improve the heat transfer from the hot orcold soaking plate, a vacuum can be applied to suck the carrier down tothe plate. The plunger and the contact sockets are also kept at testtemperature.

In the test modules 501 shown in FIGS. 12 and 13, the grippers rotatecounter-clockwise around the rotary table 503. However, the grippersmay, alternatively, rotate clockwise around the rotary table 503. Therotary table 503 is configured such that, when carriers 600 are held bythe grippers, the carriers 600 are aligned radially outward from arotational axis of the rotary table 503, and remain radially alignedwhile the carriers 600 rotate around the rotary table 503.

The test module 501 includes a vision alignment system. The visionalignment system permits visual alignment of groups of components. Thecarrier 600 and/or the array of components on the carrier 600 can bealigned in the x, y, and 0 directions to the test head and/or the arrayof test sockets of the test head. In this embodiment, the visionalignment system includes cameras that measure positions of fiducialmarkers located on the carrier 600 and fiducial markers located on thetest head. Based on offsets of corresponding fiducial markers, aposition controller for the plunger is configured to move the plungersuch that the components in the carrier 600 are aligned to the testsockets of the test head.

Input/Output Module

The integrated testing and handler mechanism 500 includes aninput/output module 502.

The input/output module 502 of the mechanism transports untestedcomponents from an input device located in an input section 511 tocarriers 600, transports the carriers 600 on a shuttle 507 to and from alocation where the carriers 600 can be retrieved by grippers of thecarrier stations 504, and transports tested components from the carriers600 to an output device located in an output section 512. The inputdevice is a film frame device, a tube type device, a bowl type device,or a detaping device for tape and reel packages. The output device is atube type device (holding one bin), a bulk type device (holding, forexample, eight bins), or a tape and reel device (holding one bin).

The input/output module 502 includes a single shuttle 507 that transferscarriers 600 between a component loading location 513 and a test moduletransfer location 514. The shuttle 507 includes precision linearencoders configured to move the carrier 600 in the x and y directions.Components are transferred into carriers 600 on the shuttle 507 at thecomponent loading location 513. The carriers 600 are retrieved bygrippers of the rotary table at the test module transfer location 514.

The input/output module 502 is turret based, including a turret 520. Forexample, the input/output module 502 may be configured similarly to theNY20 turret handler, or the NY32 turret handler, available from Cohu,Inc. The turret 520 includes a plurality of pickup heads 515 that rotatearound the turret 520 for moving components to be tested to the carriers600 from the input section 511 and from the carriers 600 to the outputsection 512. Loading and unloading is done simultaneously. The turret520 picks a tested device and replaces it by an untested device, untilthe entire carrier 600 is populated by untested devices. Theinput/output module 502 preferably has a throughput of at least 22,000components per hour.

Carriers

In the fourth embodiment, the carriers 600 are vacuum carriers, as shownin FIGS. 14-18. The carriers 600 include a main body 601, a front vacuuminterface 602, and a bottom vacuum interface 603, as shown in FIGS.14-16. The front vacuum interface 602 includes a one-way valve 602 a,and the bottom vacuum interface 603 includes a one-way valve 603 a.

FIGS. 17 and 18 depict cross-sectional views of the main body 601 of acarrier 600 along part of the line A-A as shown in FIG. 16. The mainbody 601 includes a lower body portion 605, an upper body portion 606,and a central vacuum supply chamber 607 located between the lower bodyportion 605 and the upper body portion 606. A component placement layer608 is disposed over the upper body portion 606. The top surface of thecomponent placement layer 608 is planar, without any apertures (commonlycalled a “kit”) to physically hold components in place. A plurality ofvacuum supply cavities 604 extend through the upper body portion 606from the central vacuum supply chamber 607 to the component placementlayer 608. The carrier 600 includes one or more vacuum supply cavities604 for each component 700. Thus, a vacuum can be supplied to thecentral vacuum supply chamber 607 via one or both of the front vacuuminterface 602 and the bottom vacuum interface 603. This vacuum issupplied to the vacuum supply cavities 604 and the component placementlayer 608, thereby allowing components 700 to be held on the componentplacement layer 708. A working area of a top surface of the carrier 600may be, for example, about 130 mm by 55 mm.

In the embodiment shown in FIG. 17, the component placement layer 608 ismade of a porous conductive material, such as a porous aluminummaterial. The material of the component placement layer 608 isnon-sintered. A thermal conductivity of the material of the componentplacement layer 608 is between 50 and 150 W/mK. The size of the pores inthe component placement layer 608 is between 5 and 200 microns. In thisembodiment, vacuum can be supplied to the pores of the porous conductivematerial via the vacuum supply cavities 604, thereby allowing components700 to be held on a top surface of the component placement layer 708.

In the embodiment shown in FIG. 18, the component placement layer 608include a plurality of micro-holes 609 that extend through the componentplacement layer 608 from each of the vacuum supply cavities to an uppersurface of the component placement layer 608. The component placementlayer 609 is made of a conductive material. A thermal conductivity ofthe material of the component placement layer 609 is between 50 and 150W/mK. A width of the holes is between 5 and 200 microns. In thisembodiment, vacuum can be supplied to the micro-holes 609 of thecomponent placement layer 608 via the vacuum supply cavities 604,thereby allowing components 700 to be held on a top surface of thecomponent placement layer 708.

Vacuum Supply to Carriers

Because components 700 are held on the carrier 600 via vacuum, anuninterrupted vacuum supply is maintained while the carrier 600 is atthe turret 520 of the input/output module 502 for component loading andunloading, during carrier transport on the shuttle 507, while thecarrier is transferred from the shuttle 507 to the rotary table 503,while the carrier is moved from the rotary table 503 to the plunger fortesting, while the carrier is on the plunger during testing, and duringthe entire return transport process from the plunger back to theshuttle. This is accomplished via a “handshake” process using the frontand bottom vacuum interfaces 602, 603 of the carrier 600.

While the carrier 600 is at the turret 520 of the input/output module502 for component loading/unloading, and during carrier transport on theshuttle 507, vacuum is supplied to the carrier 600 by an input/outputmodule vacuum source via the bottom vacuum interface 603 of the shuttle507. After completion of the carrier loading/Unloading, the shuttle 507moves the carrier 600 into the gripper of the rotary table 503. When thecarrier 600 has reached the bottom of the gripper, the vacuum is thensupplied through the front vacuum interface 602 of the carrier by therotary table/gripper. Then, bottom vacuum supply through the shuttle isswitched off (handshake) This vacuum source continues to supply vacuumto the carrier 600 while the carrier 600 is moved by the rotary tableover the conductive soaking area 509. When the carrier 600 reaches theplunger transfer location 506, vacuum is then supplied to the carrier600 by a plunger vacuum source via the bottom vacuum interface 603. Theplunger moves under the gripper of the rotary table 503, docks to thecarrier (the rotary table with the carrier 600 moves around 3 mmdownwards to place the carrier onto the plunger) and then suppliesvacuum from the bottom vacuum interface 603 through the plunger to thecarrier 600. After the vacuum supply from the plunger has beenestablished, the vacuum from the rotary table/gripper is switched offand then the carrier 600 is moved out of the gripper by the plunger,maintaining the vacuum.

The plunger can perform now the contacting movements in x, y and zdirection. The carrier can either be moved stepwise or in total. Totransport the carrier 600 back to the rotary table 503, the plungermoves the carrier 600 back into the gripper (radial movement) of therotary table 503. When the carrier 600 has reached the bottom of thegripper, the vacuum is then supplied through the front vacuum interface602 of the carrier 60. After the vacuum supply is transferred back tothe rotary table. The bottom vacuum supply from the plunger is switchedoff. This vacuum source continues to supply vacuum to the carrier 600while the carrier 600 is moved by the rotary table through thedc-soaking area 510. When the carrier 600 reaches the input/outputshuttle transfer location 505, vacuum is then supplied to the carrier600 by an input/output module vacuum source via the bottom vacuuminterface 603. This vacuum source continues to supply vacuum to thecarrier 600 while during carrier transport on the shuttle 507 and whilethe carrier 600 is at the turret 520 of the input/output module 502 forcomponent unloading

The shuttle 507 moves under the gripper of the rotary table 503, docksto the carrier 600 (the rotary table with the carrier moves around 3 mmdownwards to place the carrier onto the shuttle) and supplies vacuumthrough the bottom vacuum interface 603 through the shuttle 507. Afterthe vacuum supply from the shuttle 507 has been established, the vacuumfrom the rotary table 503 is switched off and then the carrier 600 ismoved out of the gripper by the shuttle 507. The shuttle 507 then movesthe carrier 600 to the loading/unloading area of the turret 520.

The integrated testing and handler mechanism 500 includes a back-upvacuum system that includes a venturi generator that will maintainvacuum if primary vacuum is lost. The vacuum level of all stations ismonitored by vacuum sensors. When the primary vacuum drops, the backupsystem steps in immediately.

Vision Alignment for Placement of Component on Carriers

The integrated testing and handler mechanism 500 includes a visionalignment system for placement of components on the carriers at theinput/output module 502. This vision alignment system includes first andsecond downward-looking cameras 701, 703 and an upward-looking camera702. The vision alignment system further includes an alignment table 704configured to hold components via vacuum. The vision alignment systemfurther includes a controller configured to control movement of thealignment table 515 and of the precision linear encoders of the shuttlebased on information received from the cameras 701, 702, 703.

Visional alignment will be described with reference to FIGS. 20-24.First, as shown in FIG. 20, the first downward-looking camera 701 viewsa component to be transferred to the carrier 600 while the component isdeadbug (i.e., while the contacts of the component face upwards). Basedon information received from the downward-looking camera 701, thecontroller determines the translational and angular offset (x, y, θ)between the contact pattern of the component and the package outline ofthe component, as shown in the inset view at the top right of FIG. 20.

Next, as shown in FIG. 21, the pickup head 515 picks up the component,and the upward-looking camera 702 views the pickup head 515 whileholding the component. Based on information received from theupward-looking camera 702, the controller determines the translationaland angular offset (x, y, θ) between the package outline of thecomponent and the pickup head 515.

Next, as shown in FIG. 22, the pickup head 515 places the component onthe alignment table 704, where the component is held by vacuum. Thepickup head is then retracted. The controller then causes the alignmenttable 704 to move such that the component is aligned to the pickup head,based on the determined translational and angular offset (x, y, θ)between the package outline of the component and the pickup head 515.After alignment, the pickup head 515 again picks up the component.

Next, as shown in FIG. 23, the second downward-looking camera 703 viewsthe carrier 600 on which the component is to be placed. The carrier 600includes two fiducials 600 a, one at each end of the carrier 600. Bymoving the carrier 600 in the longitudinal direction along the shuttle507 under the second downward-looking camera 703, the controllerdetermines the translational and angular offset (x, y, θ) between thecarrier 600 and the pickup head 515. If the carrier 600 is still at anelevated temperature from conductive soaking, the thermal elongation ofthe carrier 600 can also be determined by the controller.

Next, as shown in FIG. 24, the controller controls the precision linearencoders to move the carrier 600 in the x and y direction so that thecarrier is properly aligned to the pickup head 515 (and thus alsoaligned to the component held by the pickup head 515), based on thedetermined translational and angular offset between the carrier and thepickup head, and optionally, based on the thermal elongation of thecarrier. After alignment, the pickup head 515 places the component onthe carrier 600.

After placement of a component on the carrier 600, the seconddownward-looking camera 703 views the component on the carrier and thecontroller determines whether the component is in the correct position.If the component is misplaced, the pickup head 515 picks up thatcomponent, and the next pickup head 515 replaces it with anothercomponent. The misplaced component is cycled around the turret of theinput/output device 502, and is re-aligned and placed on another carrier600.

This process is then repeated for any additional components to be placedon the carrier 600. Because the carrier 600 is kitless (i.e., does notcontain any apertures in which components are placed), any desiredcomponent patter on the carrier 600 can be generated.

Detecting Device Shingling

Shingling can occurs when components are misaligned on a carrier duringplacement, such that one component is inadvertently placed partially ontop of another component. The pickup head 515 includes force anddisplacement sensors to detect z-axis force exerted on the pickup head,and to detect the z-displacement of the pickup head. The controller ofthe integrated testing and handler mechanism 500 is configured toreceive information from the force and displacement sensors and retractthe pickup head 515 immediately upon detection of shingling. Themisplaced component is picked up again from the carrier 600 and replacedby the next component. The misplaced component will be cycled around theturret, re-aligned, and the placed onto the next carrier 600.

Docking and Undocking

The input/output module 502 is removably dockable to the test module 501via rigid docking pins and a pneumatic self-clamping and centeringmechanism, as shown in FIG. 26. To perform the docking procedure, thetest module 501 is first moved so that the contactor area 508 is underthe test head. The test module 501 is then leveled and aligned to thetest head. The input/output module 502 is then moved towards the testmodule 501, and the height of the input/output module 502 is adjusted inaccordance with the height of the test module 501. The input/outputmodule 502 is then docked and locked to the test module 501 using therigid docking pins and the pneumatic self-clamping and centeringmechanism.

Operation of the Carrier Transfer Type Pick and Place System

The integrated testing and handler mechanism 500 of the fourthembodiment operates as follows. Components to be tested are loaded intothe input section 511. The pickup heads 515 of the turret 520 pick upcomponents at the input section 511. After vision alignment (asdiscussed in detail above), the pickup heads 515 transfer components tothe carrier 600 while the carrier 600 is in the component loadinglocation 513. The shuttle 507 moves the carrier 600 from the componentloading location 513 into the gripper of the rotary table 503 at thetest module transfer location 514. The rotary table 503 with the grippertransports the carrier 600 from the input/output module transferlocation 505 to the plunger area. During the stepwise transportation ofthe carriers over the conductive soaking plate, they are heated up orcooled down to a set temperature. At the plunger area, the carrier ismoved by the plunger out of the gripper.

The plunger plunges the component on the carrier 600 into the testsockets of the test head. After testing, the plunger then moves thecarrier 600 back into the gripper of the rotary table 503. The rotarytable 503 with the grippers 504 rotates the carrier 600 from the plungertransfer location 506 to the input/output module transfer location 505,while de-soaking them to a set temperature. The shuttle then moves thecarrier 600 at the test module transfer location 514 out of the gripperto the component unloading/loading location 513. Finally, the pickupheads 515 of the turret 520 pick up tested component from the carrier600 and transfer them to the output section 512.

The foregoing description of embodiments has been presented for purposesof illustration and description. The foregoing description is notintended to be exhaustive or to limit embodiments of the presentinvention to the precise form disclosed, and modifications andvariations are possible in light of the above teachings or may beacquired from practice of various embodiments. The embodiments discussedherein were chosen and described in order to explain the principles andthe nature of various embodiments and its practical application toenable one skilled in the art to utilize the present invention invarious embodiments and with various modifications as are suited to theparticular use contemplated. The features of the embodiments describedherein may be combined in all possible combinations of methods,apparatus, modules, systems, and computer program products.

1.-43. (canceled)
 44. A method comprising: providing a carrier having a plurality of holes defined in a surface thereof, the carrier comprising a first vacuum interface in communication with the plurality of holes, and a second vacuum interface in communication with the plurality of holes; connecting the first vacuum interface of the carrier to a first vacuum generator such that the first vacuum generator communicates with the plurality of holes; applying a vacuum to the components through the plurality of holes using only the first vacuum generator; placing a plurality of components on the surface of the carrier while the first vacuum generator applies the vacuum through the plurality of holes; connecting the second vacuum interface of the carrier to a second vacuum generator such that the second vacuum generator communicates with the plurality of holes; applying a vacuum to the components through the plurality of holes using the second vacuum generator, in addition to the first vacuum generator; disconnecting the first vacuum interface of the carrier from the first vacuum generator, such that the first vacuum generator ceases application of the vacuum through the plurality of holes, and the vacuum is applied to the components through the plurality of holes using only the second vacuum generator.
 45. The method of claim 44, further comprising: transporting the carrier from a location at which the components were placed on the surface of the carrier, to another location, while the vacuum is applied to the components through the plurality of holes using only the first vacuum generator.
 46. The method of claim 44, wherein the step of placing the components on the surface of the carrier is performed using at least one component handling head disposed on a rotatable turret.
 47. The method of claim 44, wherein the step of connecting the second vacuum interface of the carrier to the second vacuum generator comprises receiving the carrier in a gripper such that, when the carrier is received in the gripper, the second vacuum generator communicates with the plurality of holes via the second vacuum interface.
 48. The method of claim 47, wherein the gripper is a part of rotary table, and the method further comprises transporting the carrier to a conductive soaking area, and adjusting a temperature of the carrier using a heating or cooling device while the carrier is in the conductive soaking area.
 49. A component handling assembly comprising: a first vacuum generator; a second vacuum generator; and at least one carrier comprising: a surface configured to support a plurality of components, the surface having a plurality of holes defined therein through which a vacuum can be applied to hold the components on the surface; a first vacuum interface in communication with the plurality of holes, the first vacuum interface being connectable to the first vacuum generator such that the first vacuum generator can apply the vacuum to the components through the plurality of holes; a second vacuum interface in communication with the plurality of holes, second first vacuum interface being connectable to the second vacuum generator such that the second vacuum generator can apply the vacuum to the components through the plurality of holes.
 50. The assembly of claim 49, further comprising: an input/output module including: an input section, an output section, a plurality of component handling heads, the component handling heads being configured to (i) move components from the input section to the carrier, and (ii) move components from the carrier to the output section, wherein the first vacuum generator is configured to apply the vacuum to the components while the components are loaded and unloaded at the input/output section.
 51. The assembly of claim 49, further comprising: a transport device configured to move the carrier from the input/output module to another location; wherein the first vacuum generator is configured to apply the vacuum to the components while the carrier is moved from the input/output module to the test module to the other location.
 52. The assembly of claim 51, further comprising a rotary table comprising a plurality of grippers configured to hold the carriers, each gripper being connected to the second vacuum generator such that, when the carrier is received in the gripper, the second vacuum generator communicates with the plurality of holes via the second vacuum interface.
 53. The assembly of claim 51, further comprising a conductive soaking module configured to adjust a temperature of the carrier using a heating or cooling device.
 54. A method comprising: aligning a component into a predefined orientation relative to a carrier using a vision alignment system; placing the aligned component on the carrier; capturing an image of the component on the carrier using a downward-looking camera, and using that image to determine if the component is correctly located on the carrier; and if the component is not correctly located on the carrier, picking the component from the boat, performing the step of aligning the component a second time.
 55. The method of claim 54, wherein the step of aligning the component into a predefined orientation comprises: capturing an image of the component using a downward-looking camera while the contacts of the component face upwards, and using that image to determine a translational and angular offset between a contact pattern of the component and a package outline of the component.
 56. The method of claim 55, wherein the step of aligning the component into a predefined orientation further comprises: picking up the component with a component handling head, capturing an image of the component on the component handling head using an upward-looking camera, and using that image to determine a translational and angular offset between the package outline of the component and the component handling head.
 57. The method of claim 56, wherein the step of aligning the component into a predefined orientation further comprises: placing the component on an alignment table using the component handling head, moving the alignment table such that the component is aligned to the component handling head, based on the determined translational and angular offset between the package outline of the component and the component handing head, and picking up the component using the component handling head.
 58. The method of claim 57, wherein the step of aligning the component into a predefined orientation further comprises: capturing an image of the carrier with a downward looking camera, and using that image to determine a translational and angular offset between the carrier and the component handling head, and moving the carrier such that the carrier is aligned to the pickup head, based on the determined translational and angular offset between the carrier and the component handling head.
 59. The method of claim 58, wherein the carrier includes a plurality of fiducials used to determine the translational and angular offset between the carrier and the component handling head.
 60. The method of claim 59, wherein the step of aligning the component into a predefined orientation further comprises: determining an elongation of the carrier caused by heating, wherein the carrier is aligned to the pickup head based on (i) the determined translational and angular offset between the carrier and the component handling head, and (ii) the determined elongation of the carrier.
 61. The method of claim 54, wherein, after a mislocated component is picked from the carrier, the component is cycled around a turret before the step of aligning the component is performed the second time.
 62. A component handling assembly comprising: a vision alignment system configured to align a component into a predefined orientation relative to a carrier; a rotatable turret comprising at least one component handling head configured to place the aligned component on the carrier; a downward looking camera configured to capture an image of the component on the carrier a controller configured to use the image to determine if the component is correctly located on the carrier, wherein the assembly is configured such that, if the component is not correctly located on the carrier, the component handling head picks up the component from the boat, and the component is cycled around the turret before the vision alignment system aligns the component a second time. 